JPS6355447U - - Google Patents
Info
- Publication number
- JPS6355447U JPS6355447U JP14818786U JP14818786U JPS6355447U JP S6355447 U JPS6355447 U JP S6355447U JP 14818786 U JP14818786 U JP 14818786U JP 14818786 U JP14818786 U JP 14818786U JP S6355447 U JPS6355447 U JP S6355447U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- board
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000005452 bending Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14818786U JPS6355447U (en]) | 1986-09-27 | 1986-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14818786U JPS6355447U (en]) | 1986-09-27 | 1986-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355447U true JPS6355447U (en]) | 1988-04-13 |
Family
ID=31062234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14818786U Pending JPS6355447U (en]) | 1986-09-27 | 1986-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355447U (en]) |
-
1986
- 1986-09-27 JP JP14818786U patent/JPS6355447U/ja active Pending